Features
• Advanced Microbolometer ROIC
• 1024 × 768 – 12 µm Array format
• 1, 2, or 4 channel digital outputs
• Programmable Biasing, Timing, and Windowing
• High Speed, Low Power, and Low Noise
• Tested ROIC parts on 200mm CMOS wafers
• Advanced Microbolometer ROIC
• 1024 × 768 – 12 µm Array format
• 1, 2, or 4 channel digital outputs
• Programmable Biasing, Timing, and Windowing
• High Speed, Low Power, and Low Noise
• Tested ROIC parts on 200mm CMOS wafers
| SPECIFICATIONS | VALUES | |||
|---|---|---|---|---|
| Array Format | 1024 × 768 | |||
| Pixel Size | 12 µm × 12 µm | |||
| ROIC Operating Mode | Rolling Line | |||
| Biasing and Timing | On-Chip Programmable | |||
| Detector Resistance | 30 kW ≤ Rdet ≤ 90 kW | |||
| Integration Time | Programmable from 1 µs to 1 ms in steps of 1 period of system clock | |||
| Number of Outputs | Programmable 1, 2, or 4 channel digital video, 1,2 or 4 analog video output is optional | |||
| Digital Outputs | 14 bit parallel digital output - Data Rate: ≤ 40 MS/s - ≤560 Mbit/s | |||
| Gain and Offset | On-Chip Programmable gain and offset | |||
| Readout Modes | Rolling Line | |||
| Windowing | Programmable size and location | |||
| Frame Rate | ≤ 40 fps for full window (1024×768) | |||
| Supply Voltage | Analog : 3.3V Core and I/O | Digital: 1.8V Core, 3.3V I/O | ||
| System / Data Clock | System: ≤ 20 MHz (Nominal 12 MHz) | Data: ≤ 40 MHz (Nominal 24 MHz) | ||
| Programming Interface | Serial Programming Interface (SPI) | |||
| For ROIC Command/Control and Non-Uniformity Correction (NUC) operations | ||||
| Power Dissipation | ≤ 600 mW @ 30 fps with 4 outputs | |||
| Output Noise Level | ≤ 4 Count@14bit (≤ 0.5 mV rms at 300 K) | |||
| Temperature | Operated with TEC: 25°C ≤ Top ≤ 30°C | Storage: -40°C ≤ Tst ≤ 80°C | ||
| Operated w/o TEC: -35°C ≤ Top ≤ 60°C | ||||
| Temperature Sensor | On-chip sensor with 1mV/K sensitivity | |||
| Wafer / Die Sizes, DPW | Wafer: 200 mm | Die: 20mm × 20mm | Total: 52 Die | 36 A+ Grade Die (Typical) |
| Pads | Dual pad structure: 1 for probing and 1 for wirebonding | |||
| Package Pin Count | ≤ 110 | |||
| Synchronization | Master Mode: self-triggered | |||
| Slave Mode: Frame synchronization via frame sync input | ||||